BGA-Reballing-Werkzeug, 20 Mm, 30 Mm, 50 Mm, Breite 30 M, Hitzebeständiges Polyimid-Reflexband, Hochtemperatur-Klebeisolierung
About The clean removal, no residue. 1 mil polyimide film & 1.syi
high temperature tape is widely used for masking during powder coating, wave soldering, circuit board production, or holding parts in place during air rework or repair of electronic components. clean removal, no residue.syi 1 mil polyimide film & 1.5 mil silicone adhesive. due to it's semi-transparent shiny gold color is also has a myriad of hobby and craft uses.
Office & School & Business & Industrial > Industrial Supplies & MRO > Adhesives & Sealants > Adhesives & Sealant
BGA-Reballing-Werkzeug, 20 Mm, 30 Mm, 50 Mm, Breite 30 M, Hitzebeständiges Polyimid-Reflexband, Hochtemperatur-Klebeisolierung
Office & School & Business & Industrial > Industrial Supplies & MRO > Adhesives & Sealants > Adhesives & Sealant
Specifications of BGA-Reballing-Werkzeug, 20 Mm, 30 Mm, 50 Mm, Breite 30 M, Hitzebeständiges Polyimid-Reflexband, Hochtemperatur-Klebeisolierung | |
|---|---|
| Category | Bürobedarf |
| Instock | instock |
